Automatic laser debonding equipmentSuitable for disassembly of temporary bonding of semiconductor packages.
全自动兼容 8 寸、 12 寸片生产，带条码自动扫描系统； ● Fully compatible with 8 -inch and 12 -inch film production, with barcode automatic scanning system;
Automatic production, compatible with 8 & 12 inch wafer, with bar code auto-scanning system;
配合特殊剥离涂层，有效减少材料损伤，良品率高； ● With special peel coating, it can effectively reduce material damage and high yield rate;
With special coating material, effectively reduce the damage, high yield;
采用先进的光斑整形技术，光斑均匀分布； ● Using advanced spot shaping technology, the spot is evenly distributed;
Advanced beam forming technique and uniformly distributed light spot;
拥有光斑质量监控与反馈系统，保证光斑的稳定性； ● With spot quality monitoring and feedback system to ensure the stability of the spot;
Beam quality monitor and feedback system ensure the quality and stability;
携带激光加工能量监控与自动补偿系统，保证能量的稳定性； ● Carry laser processing energy monitoring and automatic compensation system to ensure energy stability;
Laser power detector and negative feedback system, provide energy stability;
Carrier 自动分离与回收功能； ● Carrier automatic separation and recycling function;
Carrier auto separation and recycle system;
Warped Wafer Handling 功能。 ● Warped Wafer Handling function.
Warped Wafer Handling Function.
Wafer and glass stripping process Stripped wafer Peeled glass