Automatic cutter wheel cutting equipmentApplication area: Suitable for cutting silicon, ceramic, glass, gallium arsenide, indium phosphide, cutting of various lead frame / substrate packages, etc., the entire series is compatible with 6-12 inch wafers.
Example model: HDL-8500 / 8510
Suitable for silicon, ceramics, glass, gallium arsenide, indium phosphide,
/ 基板类封装体的切割等材料 Cutting of various lead frame / substrate packages and other materials
6-12 寸晶圆。 The full series is compatible with 6-12 inch wafers.
Blade saw applied for silicon, ceramic, gallium
arsenide, and various materials like lead-frame
and substrate, compatible with 6-12 inch wafer.
Main Features Main Features
外观尺寸追求小型化，占地面积小，切割行程大； ● The appearance size pursues miniaturization, small footprint and large cutting stroke;
Miniaturized size and occupied area, but with huge working range;
配备 NCS 、 BBD 、漏液检测模块、远程控制模块，智能化、高效化适应客户需求； ● Equipped with NCS , BBD , leak detection module, remote control module, intelligent and efficient to meet customer needs
Equipped with NCS (Non-Contact Setup) block, BBD (blade break detect) block and weeping detecting block, adapt to customer's requirements intelligently and efficiently;
大功率主轴，高速高精度电机，大幅提高生产效率； ● High-power spindle, high-speed and high-precision motor, which greatly improves production efficiency;
High power spindle, high speed & high precision motor, highly increase the yield;
高效的自动对准，自动刀痕识别以及崩边检测功能； ● Efficient automatic alignment, automatic knife mark recognition and chipping detection function;
Efficient auto-focus, auto cutting line recognition and chipping detection function;
多种切割模式任意选择，配有数据管理和日志管理系统，随时监控生产状况； ● A variety of cutting modes can be selected arbitrarily, equipped with data management and log management system to monitor the production status at any time;
Switch to various cutting mode arbitrarily, with data management and log management system, easy to monitor the manufacture process at any time;
配备 17 英寸触屏显示器，呈现更多信息。 ● Equipped with 17 -inch touch screen display for more information.
Equipped with 17 inch touch screen, getting more information during the working process.
Main Parameters Main parameters
(Spindle Power) Spindle Power
可选 (Optional for 1.5/1.8/2.4kw) Optional for 1.5 / 1.8 / 2.4kw (Optional for 1.5 / 1.8 / 2.4kw)
轴最大返程速度 (X Axis Maximum Speed) X Axis Maximum Speed
800mm / s
轴直线度 (X Axis Straightness) X Axis Straightness
0.001mm/250mm ± 0.001mm / 250mm
轴重复步进精度 (Y Axis Repeat Stepping Precision) Y Axis Repeat Stepping Precision
以内 /5mm Within 0.001 / 5mm
轴重复精度 (Z Axis Repeating Precision) Z axis repeating precision
( θ Axis Repeat Positioning Accuracy) θ Axis Repeat Positioning Accuracy
( θ Axis Repeating Accuracy) θ Axis Repeating Accuracy
(Vision System) Vision System
/ 低倍 / 双倍显微镜可选 (Optional for high power/low power/double microscope) Optional for high power / low power / double microscope
(Main Functions) Main functions
NCS 、 BBD 、漏液检测 Auto Alignment, Auto Focus, Edge Recognition, Cutting line Recognition, Chipping Detection, Auto alignment, auto focus, edge finding recognition, knife mark recognition, chipping detection, NCS , BBD , leak detection Auto Alignment, Auto Focus, Edge Recognition, Cutting line Recognition, Chipping Detection,
Non-Contact Setup, Blade Break Detection, Weeping Detection