Sapphire automatic precision laser cutting machineApplicable to the processing of brittle materials such as strengthened glass, plain glass, sapphire.
该设备专为高精度、高良率和高效率加工脆性材料而设计； 1. This equipment is designed for high-precision, high-yield and high-efficiency processing of brittle materials;
全自动上下料设计，特别适用于大批量生产； 2. Fully automatic loading and unloading design, especially suitable for mass production;
所有治具、料盒和料盘均采用高强度工程塑料，可长时间无差别使用，全程自动收集废料无需人工清扫。 3. All fixtures, boxes and trays are made of high-strength engineering plastics, which can be used without any difference for a long time, and the waste is automatically collected throughout the process without manual cleaning.
● Processing range: incoming material ≤100mmx100mm
Φ10 mm@ 玻璃 ● Cutting efficiency: ≈100mm / s Reference: 2s / pcs @ T0.2mm @ Φ10 mm @ 玻璃
μ m ● Dimensional accuracy: ± 30 μ m
μ m ● Collapse: <20 μ m
μ m ● Ink damage: ≤30 μ m
可切割与腰型类似的异性产品 Can efficiently cut standard round sapphire products