Automatic UV laser scribing equipmentIt is mainly used for LED red and yellow light silicon wafer cutting, and also for cutting special materials such as ceramics and metals.
多激光点切割技术，提供特殊材料（硅衬底）的高品质加工； 1. Multi-laser point cutting technology, providing high-quality processing of special materials (silicon substrates);
可兼容2英寸，4英寸，6英寸的晶圆切割； 2. Compatible with 2 inch, 4 inch, 6 inch wafer cutting;
具备自动涂胶，清洗功能； 3. With automatic gluing and cleaning functions;
全自动上下料功能，无人值守式全自动运行。 4. Full-automatic loading and unloading function, unattended automatic operation.
The main parameters:
● Maximum processing speed: 500mm / s
● X / Y table travel: 300X600mm Resolution: X = 0.5μm; Y = 0.1μm
● X / Y repeat positioning accuracy: ± 1μm X straightness: ± 1μm / 300mm
● Maximum rotation angle of Θ axis: 120deg Positioning accuracy: 15arc-sec
Silicon wafer silicon wafer ceramic solar panel
Silicon Carbide Base Metal Base Epoxy Laminated Glass