Automatic IC reel packaging equipment
Application areas: Mainly used for the packaging of 7-inch and 13-inch reels in the process of the semiconductor industry. It can automatically realize the labeling of reels and aluminum foil bags, automatically send the reels, desiccants, and humidity to the aluminum foil bags and evacuate And complete heat sealing, and finally realize reel packaging.
Automatic cutter wheel cutting equipment
Application area: Suitable for cutting silicon, ceramic, glass, gallium arsenide, indium phosphide, cutting of various lead frame / substrate packages, etc., the entire series is compatible with 6-12 inch wafers.
Automatic precision laser drilling equipment
Application area: mainly used for punching holes and blind holes in materials such as glass and ceramics
Automatic laser debonding equipment
Application: Suitable for disassembly of temporary bonding of semiconductor packages.
Automatic wafer laser slotting equipment
Application area: for wafers with low-k material or metal plating, grooves on the surface of the wafer for subsequent cutting
Shingle one machine
Application areas: conventional, PERC monopoly, N-PERT and other batteries
Laser doping machine
Application: Suitable for SE solar cells and PERC solar cells.
Laser film opener
Application: Suitable for PERC solar cells and IBC solar cells.
Automatic laser scribing machine
Application: Automatic laser scribing machine is used for the automated production of high-efficiency photovoltaic modules. Dicing modules reduce the series current and reduce resistive losses, thereby increasing the power output of photovoltaic modules
Automatic wafer modification and cutting equipment
Based on common semiconductor materials such as silicon, silicon carbide, and GaN, we have developed a high-precision, high-efficiency fully automatic laser internal modification and cutting device for transparent substrate wafers. Han's DSI Develop laser internal modification machine specified for semiconductor materials, like Silicon, Silicon Carbide, Gallium Nitride, which is of high precision and high efficiency.
Automatic laser marking equipment
It is suitable for the packaging segment of the semiconductor industry, and meets the marking of various lead frame and substrate IC products such as SOT, QFN, LGA, BGA.
It is mainly used in the last process of surface-mount semiconductor device production. It can fully complete the electrical parameter test, classification, selection, storage, laser printing labeling, label detection, external dimension detection, and final taping and packaging output of the device.