LED chip segments can provide a full range of equipment and intelligent workshop solutions, with a market share of more than 80%.
LED laser stripping equipment
Suitable for LED vertical structure, MicroLED, etc., peeling sapphire from the substrate.
Wafer turning machine
It is used to sort wafers in the LED industry.
Automatic ceramic cutting equipment
Suitable for LED and inductor industries.
Automatic UV Full Cut Equipment
Mainly used in the full-cut operation of Si, SiC, GaN and other materials.
CSP automatic film cutting machine
Mainly used for cutting processing of CSP chip, fluorescent film and other soft materials
Filter cutting equipment
Suitable for cutting blue and white glass filters.
Flip point measuring machine
LED industry 2-4 inch flip chip
Automatic UV laser scribing equipment
It is mainly used for LED red and yellow light silicon wafer cutting, and also for cutting special materials such as ceramics and metals.
Fully Automatic Splitting Machine
It is used for LED chip chipping operation, and also used for other half-cut products, such as glass, ceramic, sapphire, and metal chipping operation.
LED modified cutting equipment
Suitable for LED sapphire cutting.